The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Oct. 08, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Dai Nakagawa, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency module () includes a multilayer board () including a plurality of insulator layers and at least one ground conductor layer (); in the multilayer board (), a transmission circuit () that is a first circuit provided in a first region and an antenna circuit () that is a second circuit provided in a second region different from the first region; and shielding conductor films (to) provided on sides of the multilayer board () and being partially in contact with the ground conductor layer (). The ground conductor layer () is not in contact with the shielding conductor films (to) in, of a side of the multilayer board (), a portion that is closest both to the first region and to the second region.