The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Sep. 30, 2016
Tyco Electronics Corporation, Berwyn, PA (US);
Vijay Daga, Sunnyvale, CA (US);
Jaydip Das, Cupertino, CA (US);
Kavitha Bharadwaj, Fremont, CA (US);
Ting Gao, Palo Alto, CA (US);
Quentin F. Polosky, Santa Clara, CA (US);
Henry Paul S. Cervantes, Santa Clara, CA (US);
TE Connectivity Services GMBH, Schaffhausen, CH;
Abstract
A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.