The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Apr. 29, 2019
Rogers Corporation, Chandler, AZ (US);
Stephen O'Connor, West Roxbury, MA (US);
Gianni Taraschi, Arlington, MA (US);
Christopher Brown, Natick, MA (US);
Kristi Pance, Auburndale, MA (US);
Karl E. Sprentall, Medford, MA (US);
Bruce Fitts, Phoenix, AZ (US);
Dirk Baars, Chandler, AZ (US);
William Blasius, Charlton, MA (US);
Murali Sethumadhavan, Acton, MA (US);
Roshin Rose George, Burlington, MA (US);
Michael S. White, Pomfret Center, CT (US);
Michael Lunt, Scotland, CT (US);
Sam Henson, Scottsdale, AZ (US);
John Dobrick, Rockwall, TX (US);
ROGERS CORPORATION, Chandler, AZ (US);
Abstract
In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.