The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Oct. 01, 2018
Applicants:
Ngk Insulators, Ltd., Aichi, JP;
Ngk Ceramic Device Co., Ltd., Aichi, JP;
Inventors:
Tomoyoshi Tai, Inazawa, JP;
Yuji Hori, Owariasahi, JP;
Takahiro Yamadera, Nagoya, JP;
Ryosuke Hattori, Ichinomiya, JP;
Kengo Suzuki, Nagoya, JP;
Assignees:
NGK INSULATORS, LTD., Aichi, JP;
NGK CERAMIC DEVICE CO., LTD., Aichi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01); H03H 3/10 (2006.01); H03H 9/02 (2006.01); H01L 41/312 (2013.01); H01L 41/332 (2013.01); H01L 41/277 (2013.01); H01L 41/311 (2013.01); H01L 41/25 (2013.01); H03H 3/04 (2006.01);
U.S. Cl.
CPC ...
H01L 41/081 (2013.01); H01L 41/0805 (2013.01); H01L 41/277 (2013.01); H01L 41/312 (2013.01); H01L 41/332 (2013.01); H03H 9/02574 (2013.01); H03H 9/02834 (2013.01); H01L 41/25 (2013.01); H01L 41/311 (2013.01); H03H 3/10 (2013.01); H03H 2003/045 (2013.01); H03H 2003/0435 (2013.01); H03H 2003/0442 (2013.01); Y10T 29/42 (2015.01);
Abstract
Described herein is a method of bonding a piezoelectric substrate to a support substrate to form a composite substrate. The piezoelectric substrate has one surface which is positively polarized, and a second surface which is negatively polarized. The method described herein includes the steps of bonding the positively polarized surface of the piezoelectric substrate to one surface of the support substrate by a direct bonding method.