The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Jan. 08, 2020
Facebook Technologies, Llc, Menlo Park, CA (US);
Zheng Sung Chio, Cork, IE;
Daniel Brodoceanu, Cork, IE;
Oscar Torrents Abad, Cork, IE;
Ali Sengül, Zurich, CH;
Pooya Saketi, Cork, IE;
Jeb Wu, Redmond, WA (US);
Chao Kai Tung, Cork, IE;
Remi Alain Delille, Cork, IE;
Tennyson Nguty, Cork, IE;
Allan Pourchet, Cork, IE;
Facebook Technologies, LLC, Menlo Park, CA (US);
Abstract
A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.