The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Oct. 22, 2019
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Daniel Henry Morris, Palo Alto, CA (US);

John Goward, Redmond, WA (US);

Chloe Astrid Marie Fabien, Seattle, WA (US);

Michael Grundmann, Kirkland, WA (US);

Assignee:

FACEBOOK TECHNOLOGIES, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09G 3/32 (2016.01); H01L 33/62 (2010.01); G02B 27/01 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 27/12 (2006.01); H01L 33/24 (2010.01); H01L 33/46 (2010.01); H01L 33/58 (2010.01); G06F 1/16 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); G02B 27/0172 (2013.01); G06F 1/163 (2013.01); G09G 3/32 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/1255 (2013.01); H01L 33/24 (2013.01); H01L 33/46 (2013.01); H01L 33/58 (2013.01); G02B 2027/0178 (2013.01); G09G 2310/08 (2013.01); G09G 2320/064 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

For small, high-resolution, light-emitting diode (LED) displays, such as for a near-eye display in an artificial-reality headset, LEDs are spaced closely together. A backplane can be used to drive an array of LEDs in an LED display. A plurality of interconnects electrically couple the backplane with the array of LEDs. As spacing between LEDs becomes smaller than interconnect spacing, a thin-film circuit layer can be used to reduce a number or interconnects between the backplane and the array of LEDs, so that interconnect spacing can be larger than LED spacing. This can allow LEDs in the LED display to be more densely arranged while still allowing use of a silicon backplane with drive circuitry to control operation of the LEDs in the LED display.


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