The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Oct. 27, 2020
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Eun Kyu Kang, Gwangju, KR;

Jong Jin Lee, Gwangju, KR;

Sang Jin Kwon, Gwangju, KR;

Won Bae Kwon, Gwangju, KR;

Dae Seon Kim, Gwangju, KR;

Soo Yong Jung, Gwangju, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/38 (2006.01); H04B 10/50 (2013.01); H01L 23/10 (2006.01); H01L 31/18 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/38 (2013.01); H01L 31/186 (2013.01); H04B 10/501 (2013.01);
Abstract

Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.


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