The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Sep. 21, 2019
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Hiroki Oka, Tokyo, JP;
Sachiyo Matsuura, Tokyo, JP;
Chiaki Hatsuta, Tokyo, JP;
Chikao Ikenaga, Tokyo, JP;
Hideyuki Okamoto, Tokyo, JP;
Masato Ushikusa, Tokyo, JP;
Assignee:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/04 (2006.01); G03F 7/00 (2006.01); G03F 7/20 (2006.01); B21B 1/22 (2006.01); C23C 14/24 (2006.01); C25D 1/04 (2006.01); C25D 3/56 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0035 (2013.01); B21B 1/22 (2013.01); C23C 14/042 (2013.01); C23C 14/24 (2013.01); C25D 1/04 (2013.01); C25D 3/562 (2013.01); G03F 7/0015 (2013.01); G03F 7/0027 (2013.01); G03F 7/2008 (2013.01); G03F 7/2022 (2013.01); H01L 51/56 (2013.01); H01L 27/32 (2013.01); H01L 51/0011 (2013.01); H01L 51/5012 (2013.01);
Abstract
The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.