The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Dec. 07, 2020
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Hsin-Hao Huang, Miao-Li County, TW;

Chu-Hong Lai, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133305 (2013.01); G02F 1/133331 (2021.01); G02F 1/133351 (2013.01); G02F 1/133512 (2013.01);
Abstract

An electronic device and a manufacturing method thereof are disclosed in the present disclosure. The electronic device comprises a first flexible substrate, a second flexible substrate and a sealing material. The first flexible substrate comprises a first laser-cutting buffer region, and the first flexible substrate comprises a first edge. The second flexible substrate comprises a second laser-cutting buffer region, and the second flexible substrate comprises a second edge. The sealing material is disposed between the first flexible substrate and the second flexible substrate. The sealing material is away from the first edge by the first laser-cutting buffer region and the sealing material is away from the second edge by the second laser-cutting buffer region. Therefore, the cracking of the sealing material can be reduced.


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