The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Mar. 11, 2020
Applicant:

Rohr, Inc., Chula Vista, CA (US);

Inventors:

Arabella Mueller, Redlands, CA (US);

Angel Cabrera, Fullerton, CA (US);

Fassil Ghebremichael, Irvine, CA (US);

Charles Novak, Perris, CA (US);

Andrew Adan, Corona, CA (US);

Dominic J. Elliott, Riverside, CA (US);

Assignee:

Rohr, Inc., Chula Vista, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/12 (2006.01); G02B 26/10 (2006.01); G02B 5/09 (2006.01);
U.S. Cl.
CPC ...
G02B 26/121 (2013.01); G02B 26/101 (2013.01); G02B 26/125 (2013.01); G02B 5/09 (2013.01);
Abstract

Various arrangements and methods are disclosed for forming one or more perforations on a substrate surface using a laser system, at least one rotating polygon mirror, and at least one other movable mirror. A rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate surface by incrementing (e.g., moving) a first mirror between a plurality of fixed (e.g., pointing) positions. A rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate using a first mirror that is maintained in a fixed (e.g., pointing) position. A first rotating polygon mirror and a second rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate surface, where the first and second polygon mirrors are used to define an extent of a given perforation in two dimensions on the substrate.


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