The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

May. 29, 2020
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Daochun Mo, Shenzhen, CN;

Qingzhi Liu, Beijing, CN;

Xiaofei Xu, Beijing, CN;

Wenyang Lei, Beijing, CN;

Chuang Wang, Beijing, CN;

Linchun Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/43 (2006.01); H04B 10/80 (2013.01); H04Q 11/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); H04B 10/801 (2013.01); H04Q 11/0005 (2013.01); H04Q 2011/0052 (2013.01);
Abstract

This application discloses an optical backplane system, which includes a first upper-level optical interconnection module, a first lower-level optical interconnection module, and a second lower-level optical interconnection module. The first upper-level optical interconnection module includes M1 first interfaces and N1 second interfaces in connection relationships. The first lower-level optical interconnection module includes L1 third interfaces and K1 fourth interfaces in connection relationships. The second lower-level optical interconnection module includes L2 third interfaces and K2 fourth interfaces in connection relationships. The first upper-level optical interconnection module is connected to one of the L1 third interfaces of the first lower-level optical interconnection module by using one of the N1 second interfaces. The first upper-level optical interconnection module is connected to one of the L2 third interfaces of the second lower-level optical interconnection module by using another one of the N1 second interfaces.


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