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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11237133 B1

PDFFull Text
Date of Patent:
Feb. 01, 2022

Filed:

Nov. 21, 2019

Comolded non-destructive inspection standard functioning as a bond bump

Applicant:

United Technologies Corporation, Farmington, CT (US);

Inventors:

David R. Lyders, Glastonbury, CT (US);

Andrew Pope, Glendale, NY (US);

Christopher Avery, Malvern, PA (US);

Daniel A. Rodrigues, Glastonbury, CT (US);

Assignee:

Raytheon Technologies Corporation, Farmington, CT (US);

Attorney:

Bachman & LaPointe, P.C.

Primary Examiner:

Herbert K Roberts

Assistant Examiner:

John M Royston

Int. Cl.
CPC ...
G01N 29/11 (2006.01); G01N 29/30 (2006.01); G01N 21/86 (2006.01); G01N 23/083 (2018.01); G01N 23/046 (2018.01);
U.S. Cl.
CPC ...
G01N 29/11 (2013.01); G01N 29/30 (2013.01); G01N 21/86 (2013.01); G01N 23/046 (2013.01); G01N 23/083 (2013.01); G01N 2021/869 (2013.01);
Abstract

An inspection feature for an adhesive bond portion between parts of a component comprising the inspection feature extending from a surface of the part of the component a predetermined bond line thickness, the inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.

Find Patent Forward Citations

Lyders, David. (2022). Comolded non-destructive inspection standard functioning as a bond bump (U.S. Patent No. 11237133). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11237133

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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