The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Aug. 18, 2017
Applicant:
Heraeus Materials Singapore Pte. Ltd., Singapore, SG;
Inventors:
Yee Weon Lim, Kuala Lumpur, MY;
Xi Zhang, Thomson, SG;
Senthil Kumar Balasubramanian, Singapore, SG;
Suat Teng Tan, Singapore, SG;
Jin Zhi Liao, Singapore, SG;
Dan Su, Singapore, SG;
Chee Wei Tok, Singapore, SG;
Murali Sarangapani, Singapore, SG;
Jurgen Scharf, Mombris, DE;
Assignee:
HERAEUS MATERIALS SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/10 (2006.01); C25D 3/46 (2006.01); C25D 5/48 (2006.01); C25D 7/06 (2006.01); H01B 13/32 (2006.01); H01B 13/02 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C25D 5/10 (2013.01); C25D 3/46 (2013.01); C25D 5/48 (2013.01); C25D 7/0607 (2013.01); H01B 1/02 (2013.01); H01B 13/02 (2013.01); H01B 13/32 (2013.01);
Abstract
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: