The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Jun. 20, 2018
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/08 (2006.01); C09J 125/16 (2006.01); C08G 18/76 (2006.01); C08G 18/40 (2006.01); C08G 18/42 (2006.01); C08G 18/48 (2006.01); C09J 173/00 (2006.01); C08L 29/04 (2006.01); C08L 23/02 (2006.01); C09J 175/04 (2006.01); C08L 23/04 (2006.01); C08L 25/16 (2006.01); B32B 27/40 (2006.01); B32B 27/36 (2006.01); C08G 65/26 (2006.01); C08L 75/04 (2006.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); B32B 21/02 (2006.01); B32B 21/14 (2006.01); B32B 27/32 (2006.01); C08L 23/10 (2006.01); B32B 13/10 (2006.01); B32B 27/08 (2006.01); B32B 13/08 (2006.01); B32B 21/08 (2006.01); B32B 27/30 (2006.01); B32B 29/00 (2006.01); B32B 21/04 (2006.01); B32B 21/13 (2006.01); B32B 13/12 (2006.01); B32B 21/06 (2006.01); B32B 27/10 (2006.01);
U.S. Cl.
CPC ...
C09J 175/08 (2013.01); B32B 7/12 (2013.01); B32B 13/08 (2013.01); B32B 13/10 (2013.01); B32B 13/12 (2013.01); B32B 21/02 (2013.01); B32B 21/04 (2013.01); B32B 21/06 (2013.01); B32B 21/08 (2013.01); B32B 21/13 (2013.01); B32B 21/14 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/40 (2013.01); B32B 29/002 (2013.01); C08G 18/4018 (2013.01); C08G 18/4202 (2013.01); C08G 18/4213 (2013.01); C08G 18/4854 (2013.01); C08G 18/7671 (2013.01); C08G 65/2615 (2013.01); C08L 23/02 (2013.01); C08L 23/04 (2013.01); C08L 23/10 (2013.01); C08L 25/16 (2013.01); C08L 29/04 (2013.01); C08L 75/04 (2013.01); C09J 125/16 (2013.01); C09J 173/00 (2013.01); C09J 175/04 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/08 (2013.01); B32B 2255/10 (2013.01); B32B 2255/12 (2013.01); B32B 2255/26 (2013.01); B32B 2307/402 (2013.01); B32B 2307/41 (2013.01); B32B 2307/412 (2013.01); B32B 2307/548 (2013.01); B32B 2307/58 (2013.01); B32B 2419/00 (2013.01); B32B 2419/04 (2013.01); B32B 2451/00 (2013.01); B32B 2457/00 (2013.01); B32B 2479/00 (2013.01); B32B 2605/00 (2013.01); C08G 2170/20 (2013.01);
Abstract
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.
Matsuda, Kenji. (2022). Moisture-curable hot melt adhesive (U.S. Patent No. 11236257). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11236257
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile