The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Aug. 22, 2016
Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Kaori Akamatsu, Ibaraki, JP;

Aya Nagatomo, Ibaraki, JP;

Atsushi Takashima, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); B32B 43/00 (2006.01); C09J 133/00 (2006.01); B32B 27/00 (2006.01); C09J 201/00 (2006.01); B32B 27/30 (2006.01); C09J 133/08 (2006.01); B32B 27/20 (2006.01); B32B 27/18 (2006.01); B32B 7/06 (2019.01); C09J 5/00 (2006.01); C09J 7/29 (2018.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 7/30 (2018.01); B32B 7/12 (2006.01); C08K 3/16 (2006.01); C08K 5/17 (2006.01); C08K 5/19 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/00 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/30 (2013.01); B32B 27/308 (2013.01); B32B 43/006 (2013.01); C09J 5/00 (2013.01); C09J 7/29 (2018.01); C09J 7/30 (2018.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 133/00 (2013.01); C09J 133/08 (2013.01); C09J 201/00 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2250/24 (2013.01); B32B 2250/246 (2013.01); B32B 2307/202 (2013.01); B32B 2307/748 (2013.01); B32B 2405/00 (2013.01); C08K 3/16 (2013.01); C08K 5/17 (2013.01); C08K 5/19 (2013.01); C09J 2203/326 (2013.01); C09J 2301/124 (2020.08); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08); C09J 2433/00 (2013.01);
Abstract

A double-sided adhesive sheet has a laminate structure including a first adhesive layer containing an electrolyte, a second adhesive layer, and a conduction substrate. A double-sided adhesive sheet joined body includes, for example, an adhesive sheet having such a laminate structure, a first conductive adherend to which the first adhesive layer adheres, and a second adherend to which the second adhesive layer adheres. A method for joining/separating adherends includes joining first and second adherends to each other via the adhesive sheet, then applying a voltage to the first adhesive layer so as to generate a potential difference in a thickness direction of the first adhesive layer, and separating the first and second adherends from each other.


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