The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Jun. 07, 2018
Applicant:

Agfa-gevaert NV, Mortsel, BE;

Inventors:

Fernando Cortes Salazar, Mortsel, BE;

Koen Steert, Mortsel, BE;

Vincent Courtet, Mortsel, BE;

Karl Van Den Bossche, Mortsel, BE;

Willem Gilbert, Mortsel, BE;

Gert Daelemans, Mortsel, BE;

Peter Willaert, Mortsel, BE;

Assignee:

AGFA-GEVAERT NV, Mortsel, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); B41M 3/00 (2006.01); B41M 5/00 (2006.01); C09D 11/037 (2014.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); C09D 11/322 (2014.01); C09D 11/54 (2014.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); B41M 3/006 (2013.01); B41M 5/0047 (2013.01); C09D 11/037 (2013.01); C09D 11/101 (2013.01); C09D 11/107 (2013.01); C09D 11/322 (2013.01); C09D 11/54 (2013.01); H05K 1/097 (2013.01); H05K 3/125 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0108 (2013.01); H05K 2203/013 (2013.01); H05K 2203/1131 (2013.01);
Abstract

A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.


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