The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Nov. 12, 2018
Applicant:

Total Research & Technology Feluy, Seneffe, BE;

Inventors:

David Ribour, Mairieux, FR;

Alain Standaert, Brussels, BE;

Armelle Sigwald, Nivelles, BE;

Aurélien Vantomme, Mignault, BE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 210/16 (2006.01); C08L 23/02 (2006.01); C08L 23/08 (2006.01); B29C 43/00 (2006.01); B29C 45/00 (2006.01); C08F 2/00 (2006.01); C08F 110/02 (2006.01); B29L 31/56 (2006.01);
U.S. Cl.
CPC ...
C08L 23/0815 (2013.01); B29C 43/003 (2013.01); B29C 45/0001 (2013.01); C08F 2/001 (2013.01); C08F 110/02 (2013.01); C08F 210/16 (2013.01); B29L 2031/56 (2013.01); C08F 2500/05 (2013.01); C08F 2500/12 (2013.01); C08L 2203/10 (2013.01); C08L 2314/02 (2013.01);
Abstract

The present invention relates to a polyethylene resin suitable for preparing moulded articles, such as caps and closures. The invention provides in particular a polyethylene resin comprising at least two polyethylene fractions A and B, wherein said polyethylene resin has a melt index (MI2), of at least 3.0 g/10 min to at most 5.5 g/10 min as measured according to ISO 1133, condition D, at 190° C. and under a load of 2.16 kg, and a density of at least 0.955 g/cmto at most 0.965 g/cmas measured according to ISO 1183 at 23° C., and a molecular weight distribution M/Mwhich is at most 7.0, as determined by gel permeation chromatography, with Mbeing the weight-average molecular weight and Mbeing the number-average molecular weight; and wherein said polyethylene fraction A has a high load melt index (HLMI), as measured according to ISO 1133:1997 condition G at 190° C. and under a load of 21.6 kg, of at least 10.5 and a melt index (MI2) of at least 0.5 g/10 min to at most 1.5 g/10 min as measured according to ISO 1133, condition D, at 190° C. and under a load of 2.16 kg. The invention further relates to a process for preparing said polyethylene resin, to a cap or closure comprising said polyethylene, and to a process for producing such a cap or closure.


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