The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Oct. 11, 2017
Applicant:
Würth Elektronik Eisos Gmbh & Co. KG, Waldenburg, DE;
Inventors:
Assignee:
WÜRTH ELEKTRONIK EISOS GMBH & CO. KG, Waldenburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 41/51 (2006.01); C04B 41/90 (2006.01); C04B 41/00 (2006.01); C04B 41/52 (2006.01); C04B 35/26 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01); C04B 41/88 (2006.01); C04B 37/02 (2006.01); C09J 7/38 (2018.01); B23K 1/00 (2006.01); C04B 111/00 (2006.01); C08K 9/00 (2006.01); C08K 7/14 (2006.01); H01F 1/34 (2006.01);
U.S. Cl.
CPC ...
C04B 41/5127 (2013.01); B23K 1/00 (2013.01); C04B 35/26 (2013.01); C04B 37/021 (2013.01); C04B 41/009 (2013.01); C04B 41/52 (2013.01); C04B 41/88 (2013.01); C04B 41/90 (2013.01); C09J 7/38 (2018.01); H01F 17/045 (2013.01); H01F 27/292 (2013.01); C04B 2111/00844 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3274 (2013.01); C04B 2235/3275 (2013.01); C04B 2235/3279 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3284 (2013.01); C04B 2235/3294 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/6562 (2013.01); C04B 2237/34 (2013.01); C04B 2237/407 (2013.01); C04B 2237/525 (2013.01); C08K 7/14 (2013.01); C08K 9/00 (2013.01); C09J 2301/208 (2020.08); H01F 1/344 (2013.01);
Abstract
The invention relates to a process for metallizing ferrite ceramics, which comprises the following steps: arrangement of a contact element composed of copper or a copper alloy on a surface of the ferrite ceramic, melting of the contact element at least in the region in which the contact element contacts the surface of the ferrite ceramic, and cooling of the contact element and the ferrite ceramic to below the melting point of copper or the copper alloy.