The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Apr. 05, 2019
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Yasuyuki Kawazu, Tokyo, JP;
Tetsuo Nakamoto, Tokyo, JP;
ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;
Abstract
Provided are a foam molded product and a method of producing the same. The foam molded product is a molded product containing a resin and including a surface layer, a compressive deformation layer, and a foam layer. The thickness of the surface layer is 0.1 mm to 5.0 mm. The compressive deformation layer is located between the surface layer and the foam layer. Foam particles forming the compressive deformation layer have an average H/L of 0.5 or less (H: length in compression direction; L: length in perpendicular direction relative to compression direction). Foam particles forming the foam layer have an expansion ratio of not less than 3.0 times and less than 30 times.