The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Jul. 14, 2017
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Shannon Reuben Woodruff, San Diego, CA (US);

Ali Emamjomeh, San Diego, CA (US);

Yi Feng, San Diego, CA (US);

Erica Fung, San Diego, CA (US);

Carolin Fleischmann, San Diego, CA (US);

Geoffrey Schmid, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); B29K 67/00 (2006.01); B29K 77/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B33Y 70/00 (2014.12); B29K 2067/04 (2013.01); B29K 2077/00 (2013.01); B33Y 10/00 (2014.12);
Abstract

This disclosure relates to a method of 3-D printing comprising: applying a layer of build material onto a print platform, wherein the build material comprises particles of a polymer comprising polymer chains having at least one reactive group that is protected with a protecting group; printing a de-protecting agent at selected locations on the layer of build material; and coalescing particles of the polymer at the printed locations on the layer of build material to form a coalesced polymer layer.


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