The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Mar. 05, 2019
Applicants:

Uacj Corporation, Tokyo, JP;

Denso Corporation, Kariya, JP;

Inventors:

Tatsuya Ide, Tokyo, JP;

Yutaka Yanagawa, Tokyo, JP;

Shogo Yamada, Kariya, JP;

Takahiro Shinoda, Kariya, JP;

Shingo Ono, Kariya, JP;

Assignee:

UACJ CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B23K 35/28 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/288 (2013.01); B23K 35/0233 (2013.01); B32B 15/011 (2013.01); B32B 15/016 (2013.01); Y10T 428/12764 (2015.01);
Abstract

A flux-free brazing aluminum alloy brazing sheet includes: a core material formed of aluminum alloy comprising Si of 0.50 to 0.90 mass %, Cu of 0.30 to 2.50 mass %, and Mn of 1.40 to 1.80 mass %, with a Mg content limited to 0.05 mass % or less, and with the balance being Al and inevitable impurities; an intermediate material being formed of aluminum alloy comprising Mg of 0.40 to 1.00 mass %, and Zn of 2.00 to 6.00 mass %, with the balance being Al and inevitable impurities; and a brazing material being formed of aluminum alloy comprising Si of 6.00 to 13.00 mass %, Mg of 0.05 to 0.40 mass %, and Bi of 0.010 to 0.050 mass %, with the balance being Al and inevitable impurities.


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