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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11235408 B1

PDFFull Text
Date of Patent:
Feb. 01, 2022

Filed:

Oct. 12, 2017

Method for bonding dissimilar metals to each other

Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Yasuyuki Fujiya, Tokyo, JP;

Ken Ishii, Tokyo, JP;

Assignee:

MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Michael A Laflame, Jr

Int. Cl.
CPC ...
B23K 9/02 (2006.01); B23K 9/23 (2006.01); B23K 11/10 (2006.01); B23K 9/04 (2006.01); B23K 26/342 (2014.01); F01D 1/06 (2006.01); F01D 25/00 (2006.01); B23K 15/00 (2006.01); B23K 31/12 (2006.01); B22F 10/20 (2021.01); B23K 101/00 (2006.01); B23K 103/18 (2006.01); B22F 7/02 (2006.01); B23K 103/20 (2006.01);
U.S. Cl.
CPC ...
B23K 9/04 (2013.01); B22F 10/20 (2021.01); B23K 15/0086 (2013.01); B23K 26/342 (2015.10); B23K 31/12 (2013.01); F01D 1/06 (2013.01); F01D 25/00 (2013.01); B22F 7/02 (2013.01); B22F 2207/13 (2013.01); B22F 2207/17 (2013.01); B22F 2998/10 (2013.01); B23K 2101/001 (2018.08); B23K 2103/18 (2018.08); B23K 2103/20 (2018.08);
Abstract

Provided is a method for bonding dissimilar metals to each other, the method comprising: dissimilar metal layer-forming steps (P), (P), (P) for supplying, to form dissimilar metal layers; a second metal layer-forming step (P) for supplying, on the surface of the dissimilar metal layers, a filler material formed of a second metal, and heating the filler material formed of the second metal to a temperature equal to or higher than a melting point of the second metal, to form a second metal layer formed of the second metal; and a second material-to-be-bonded welding step (P) for welding a second material to be bonded that is formed of the second metal, onto the second metal layer.

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