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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11235406 B1

PDFFull Text
Date of Patent:
Feb. 01, 2022

Filed:

Dec. 30, 2019

High-efficiency soldering apparatus for winding head of flat-wire motor and soldering process

Applicant:

Hefei Jee Power Systems Co., Ltd., Anhui, CN;

Inventors:

Lei Liu, Anhui, CN;

Biaolong Zhu, Anhui, CN;

Wenming Ma, Anhui, CN;

Chunzhe Sun, Anhui, CN;

Xu Tian, Anhui, CN;

Assignee:

HEFEI JEE POWER SYSTEMS Co., Ltd., Anhui, CN;

Attorneys:

Craft Chu PLLC

Andrew W. Chu

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/00 (2006.01); B23K 3/06 (2006.01); B23K 1/08 (2006.01); B23K 1/20 (2006.01); H02K 3/50 (2006.01); H02K 15/00 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0669 (2013.01); B23K 1/08 (2013.01); B23K 1/203 (2013.01); H02K 3/50 (2013.01); H02K 15/0062 (2013.01);
Abstract

The high-efficiency soldering apparatus for a winding head of a flat-wire motor includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray. The solder tray is provided at the center of the support base. The solder spot isolation and limit plate is provided on the solder tray. The shaft lever is provided on the support base. The movable tray is provided on the shaft lever. The movable tray is located above the solder tray. The movable tray moves vertically along the shaft lever. A stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray.

Find Patent Forward Citations

Liu, Lei. (2022). High-efficiency soldering apparatus for winding head of flat-wire motor and soldering process (U.S. Patent No. 11235406). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11235406

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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