IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11235387 B1

PDFFull Text
Date of Patent:
Feb. 01, 2022

Filed:

Mar. 07, 2016

Workpiece processing method

Applicant:

Dmg Mori Co., Ltd., Yamatokoriyama, JP;

Inventors:

Masahiko Mori, Yamatokoriyama, JP;

Yuhei Mezawa, Yamatokoriyama, JP;

Shigeyuki Takashima, Yamatokoriyama, JP;

Shigetsugu Sakai, Yamatokoriyama, JP;

Makoto Fujishima, Yamatokoriyama, JP;

Assignee:

DMG MORI CO., LTD., Yamatokoriyama, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Patricia L Hailey

Assistant Examiner:

Christopher D Moody

Int. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 3/105 (2006.01); B22F 3/16 (2006.01); B23B 11/00 (2006.01); B23K 26/00 (2014.01); B23K 26/144 (2014.01); B23K 26/342 (2014.01); B23P 23/04 (2006.01); B23P 23/06 (2006.01); B29C 64/30 (2017.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B23B 1/00 (2006.01); B23B 3/30 (2006.01); B23P 15/00 (2006.01); B28B 1/32 (2006.01); B22F 3/24 (2006.01); B29C 64/106 (2017.01);
U.S. Cl.
CPC ...
B22F 3/105 (2013.01); B22F 3/16 (2013.01); B22F 3/162 (2013.01); B22F 10/20 (2021.01); B23B 1/00 (2013.01); B23B 3/30 (2013.01); B23B 11/00 (2013.01); B23K 26/0093 (2013.01); B23K 26/144 (2015.10); B23K 26/342 (2015.10); B23P 15/00 (2013.01); B23P 23/04 (2013.01); B23P 23/06 (2013.01); B28B 1/32 (2013.01); B29C 64/30 (2017.08); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B22F 2003/247 (2013.01); B29C 64/106 (2017.08); Y02P 10/25 (2015.11);
Abstract

A workpiece processing method is a method for successively processing a plurality of workpieces including a first workpiece and a second workpiece in a single machining area. The workpiece processing method includes: performing additive manufacturing on the second workpiece in the machining area; and performing subtractive manufacturing on the first workpiece in the machining area while keeping on standby the second workpiece on which additive manufacturing is performed. In this way, the workpiece processing method with improved productivity is provided.

Find Patent Forward Citations

Loading…