The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Feb. 03, 2017
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Gary G. Lutnesky, Corvallis, OR (US);
Dennis R. Esterberg, Corvallis, OR (US);
Matthew David Smith, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B01L 9/00 (2006.01); G01N 35/10 (2006.01);
U.S. Cl.
CPC ...
B01L 3/527 (2013.01); B01L 9/52 (2013.01); G01N 35/10 (2013.01); G01N 35/1002 (2013.01); B01L 2200/0605 (2013.01); B01L 2200/14 (2013.01); B01L 2300/06 (2013.01); G01N 2035/1034 (2013.01);
Abstract
A fluid ejection device may include a blank cassette that includes a substrate, a die coupled to the substrate, a number of assigned electrical traces formed on the substrate, and a number of unassigned electrical traces formed on the substrate. At least one wirebond may couple at least one of the unassigned electrical traces to the die thereby assigning at least one function to the fluid ejection device.