The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Jun. 30, 2016
Applicant:
Zeon Corporation, Tokyo, JP;
Inventors:
Naohiro Igari, Tokyo, JP;
Shinji Kato, Tokyo, JP;
Tetsuya Akabane, Tokyo, JP;
Tomoya Taniyama, Tokyo, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A41D 19/00 (2006.01); B29C 41/14 (2006.01); B29C 41/20 (2006.01); B29K 105/08 (2006.01); B29L 31/48 (2006.01); B29D 99/00 (2010.01);
U.S. Cl.
CPC ...
A41D 19/0065 (2013.01); A41D 19/0006 (2013.01); B29C 41/14 (2013.01); B29C 41/20 (2013.01); A41D 2500/54 (2013.01); A41D 2600/20 (2013.01); B29D 99/0067 (2013.01); B29K 2105/0809 (2013.01); B29L 2031/4864 (2013.01);
Abstract
A dip-formed article includes a laminate in which a rubber layer is laminated on a fiber base material. The thickness of the rubber layer is 0.2 to 0.8 mm, the rubber constituting the rubber layer penetrates into the fiber base material, the maximum depth to which the rubber has penetrated into the fiber base material is 0.1 to 0.3 mm, and the maximum stress at 50% elongation of the laminate is 20 N or smaller.