The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Jan. 21, 2021
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Po-Yun Hsu, Miao-Li County, TW;

Ker-Yih Kao, Miao-Li County, TW;

Chia-Ping Tseng, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); H05K 3/0017 (2013.01); H05K 1/056 (2013.01); Y10T 29/49165 (2015.01); Y10T 29/5313 (2015.01);
Abstract

An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.


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