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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11234082 B1

PDFFull Text
Date of Patent:
Jan. 25, 2022

Filed:

Mar. 07, 2018

Carrier substrate for stress sensitive device and method of manufacture

Applicant:

Tdk Corporation, Tokyo, JP;

Inventor:

Wolfgang Pahl, Munich, DE;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Matthew A Eason

Assistant Examiner:

Kuassi A Ganmavo

Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01); H04R 19/00 (2006.01); B81B 3/00 (2006.01); H01L 23/053 (2006.01); H01L 33/48 (2010.01); B06B 1/02 (2006.01); H01L 23/02 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0048 (2013.01); B81C 1/00325 (2013.01); B06B 1/0292 (2013.01); B81B 3/0072 (2013.01); B81B 2201/0257 (2013.01); H01L 21/52 (2013.01); H01L 23/02 (2013.01); H01L 23/053 (2013.01); H01L 24/06 (2013.01); H01L 33/486 (2013.01); H04R 19/005 (2013.01); H04R 2201/003 (2013.01);
Abstract

A carrier substrate and a method for making a carrier substrate are disclosed. In an embodiment a carrier substrate includes a substrate body having a multilayer structure, electrical connection pads on a top surface of the substrate body, an organic cushion layer on the top surface of the substrate body, electrically conductive elongated parts arranged on top of the cushion layer, wherein each conductive elongated part is contacted to a respective electric connection pad and a solder pad located at an end of each elongated part distant from the respective connection pad.

Find Patent Forward Citations

Pahl, Wolfgang. (2022). Carrier substrate for stress sensitive device and method of manufacture (U.S. Patent No. 11234082). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11234082

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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