The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Feb. 01, 2020
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Myunghwan Park, Irvine, CA (US);

Jermyn Tseng, Irvine, CA (US);

John Tzung-Yin Lee, Costa Mesa, CA (US);

David Steven Ripley, Marion, IA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/52 (2006.01); H03F 3/195 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H03F 1/523 (2013.01); H01L 27/0266 (2013.01); H03F 3/195 (2013.01); H03F 2200/441 (2013.01); H03F 2200/451 (2013.01);
Abstract

Concurrent electrostatic discharge and surge protection clamps in power amplifiers. In some embodiments, a semiconductor die can include a semiconductor substrate and an integrated circuit implemented on the semiconductor substrate. The integrated circuit can include a power amplifier and a controller. The semiconductor die can further include a clamp circuit implemented on the semiconductor substrate and configured to provide electrostatic discharge protection and surge protection for at least some of the integrated circuit.


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