The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Oct. 31, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Ju Hyoung Park, Suwon-si, KR;

Kyu Bum Han, Suwon-si, KR;

Jae Yeong Kim, Suwon-si, KR;

Jeong Ki Ryoo, Suwon-si, KR;

Sung Nam Cho, Suwon-si, KR;

Sung Yong An, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 19/10 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0025 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 9/045 (2013.01); H01Q 19/10 (2013.01); H01Q 21/065 (2013.01);
Abstract

A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.


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