The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Jun. 03, 2020
Applicant:

Kmw Inc., Hwaseong-si, KR;

Inventors:

Duk Yong Kim, Yongin-si, KR;

Jun Woo Yang, Hwaseong-si, KR;

Jin Soo Yeo, Hwaseong-si, KR;

Chang Woo Yoo, Hwaseong-si, KR;

Min Sik Park, Hwaseong-si, KR;

Hye Yeon Kim, Gangjin-gun, KR;

Assignee:

KMW INC., Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/02 (2006.01); H01Q 1/42 (2006.01); H01Q 1/22 (2006.01); H01Q 1/40 (2006.01); H04B 7/0413 (2017.01);
U.S. Cl.
CPC ...
H01Q 1/02 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/405 (2013.01); H01Q 1/42 (2013.01); H04B 7/0413 (2013.01);
Abstract

The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.


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