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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11233199 B1

PDFFull Text
Date of Patent:
Jan. 25, 2022

Filed:

Jul. 25, 2016

Vapor deposition mask manufacturing method, vapor deposition mask, and organic semiconductor element manufacturing method

Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Koshi Nishida, Osaka, JP;

Kozo Yano, Osaka, JP;

Katsuhiko Kishimoto, Osaka, JP;

Susumu Sakio, Osaka, JP;

Hideo Takei, Osaka, JP;

Assignee:

HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Kevin M Bernatz

Int. Cl.
CPC ...
H01L 51/00 (2006.01); C23C 14/24 (2006.01); C23C 14/04 (2006.01); B32B 3/14 (2006.01); B32B 7/025 (2019.01); H01L 27/32 (2006.01); H01L 51/50 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0011 (2013.01); B32B 3/14 (2013.01); B32B 7/025 (2019.01); C23C 14/042 (2013.01); C23C 14/24 (2013.01); H01L 27/3211 (2013.01); H01L 27/3246 (2013.01); B32B 2307/208 (2013.01); H01L 51/001 (2013.01); H01L 51/5056 (2013.01); H01L 51/5072 (2013.01); H01L 51/5092 (2013.01); H01L 51/5203 (2013.01); H01L 51/56 (2013.01); Y10T 428/32 (2015.01);
Abstract

A method for manufacturing a vapor deposition mask including a resin layer, and a magnetic metal layer formed on the resin layer, the method including the steps of: providing a substrate; forming a resin layer by applying a solution including a resin material or a precursor solution of a resin material on a surface of the substrate, and then performing a heat treatment thereon; forming a magnetic metal layer on the resin layer, mask portion including a solid portion where a metal film is present and a hollow portion where the metal film is absent; forming a plurality of openings in a region of the resin layer that is located in the hollow portion of the mask portion; and removing the resin layer from the substrate after forming a plurality of openings in a region of the resin layer.

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