The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Mar. 31, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Hiroaki Ukawa, Itano-gun, JP;

Ryuichi Nakagami, Anan, JP;

Ryuji Muranaka, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/46 (2010.01); H01L 23/00 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 24/45 (2013.01); H01L 33/46 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light-emitting device includes: a light-emitting element; a base including a first lead having an element disposal portion and a first wire bonding portion, a second lead having a second wire bonding portion and a fixing member; a frame provided on a upper surface of the base; an Ag plating layer covering an upper surface of the element disposal portion; an Au plating layer covering at least an upper surface of the first wire bonding portion and at least an upper surface of the second wire bonding portion; a first wire; and a second wire. The Ag plating layer is disposed apart inwardly from at least a part of an outer circumference of an end portion of the element disposal portion, and the frame body is provided at a position that the frame body covers the Ag plating layer, the first wire bonding portion, and the second wire bonding portion.


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