The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
May. 18, 2018
Ningbo Sunny Opotech Co., Ltd., Yuyao, CN;
Mingzhu Wang, Yuyao, CN;
Nan Guo, Yuyao, CN;
Zhenyu Chen, Yuyao, CN;
Takehiko Tanaka, Nara, JP;
Jingfei He, Yuyao, CN;
Zhen Huang, Yuyao, CN;
Zhongyu Luan, Yuyao, CN;
Feifan Chen, Yuyao, CN;
NINGBO SUNNY OPOTECH CO., LTD., Zhejiang, CN;
Abstract
A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.