The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Oct. 15, 2013
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Kazuo Yoshida, Hyogo, JP;
Masato Negishi, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 21/268 (2006.01); H01L 21/302 (2006.01); H01L 21/78 (2006.01); H01L 29/30 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 21/268 (2013.01); H01L 21/302 (2013.01); H01L 21/78 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 29/30 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/92 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/06183 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32106 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83365 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/95 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/3841 (2013.01);
Abstract
A semiconductor device according to the present invention includes a mount substrate, an adhesive applied to the mount substrate, and a device having its lower surface bonded to the mount substrate with the adhesive. The surface roughness of a side surface upper portion of the device is lower than that of a side surface lower portion of the device.