The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Jun. 03, 2020
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Shintaro Otsuka, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A electronic component includes a connection electrode on a wiring layer. An electrically conductive layer is connected to the wiring layer via the connection electrode. A protective film covers a cover portion and the electrically conductive layer. A solder bump is electrically connected to the electrically conductive layer via an opening. An alloy layer is between the solder bump and the electrically conductive layer in a thickness direction to join the solder bump to the electrically conductive layer and differs in composition and/or elements from the solder bump. The connection electrode does not overlap the solder bump. The surface of the electrically conductive layer that is located on a protective film side is in contact with the protective film between the alloy layer and an edge of the electrically conductive layer that is located on a connection electrode side.