The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Oct. 03, 2019
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Michael Lee Dawson, McKinney, TX (US);
Edward J. Pryor, III, Royse City, TX (US);
Jeffrey L. Large, Richardson, TX (US);
Mary Coles, Dallas, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 49/02 (2006.01); H01Q 1/22 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 28/10 (2013.01); H01Q 1/2283 (2013.01);
Abstract
An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.