The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Sep. 18, 2018
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Steven J. Keating, Sunnyvale, CA (US);

Daniel D. Sunshine, Sunnyvale, CA (US);

Benjamin J. Grena, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); D02G 3/12 (2006.01); D02G 3/36 (2006.01); D02G 3/44 (2006.01); H01L 33/62 (2010.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 25/16 (2006.01); H01L 25/075 (2006.01); D03D 1/00 (2006.01); D03D 15/47 (2021.01);
U.S. Cl.
CPC ...
H01L 23/5387 (2013.01); D02G 3/12 (2013.01); D02G 3/36 (2013.01); D02G 3/441 (2013.01); D03D 1/0088 (2013.01); D03D 15/47 (2021.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/0655 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 33/62 (2013.01); D10B 2101/20 (2013.01); D10B 2401/16 (2013.01); D10B 2401/18 (2013.01);
Abstract

A fabric-based item may include fabric formed from intertwined strands of material with embedded circuitry. The strands of material may be formed from dielectric materials such as polymers. The strands of material may be formed from joined segments of polymer strand material or other material. Each joined segment may contain a potentially distinct circuit. Some joined segments may include one or more conductive lines. The conductive lines may run parallel to each other along the length of the joined segments to form circuit interconnects. Conductive lines may be joined to contact pads on integrated circuits and other embedded components formed from semiconductor dies. Control circuitry formed from the integrated circuits embedded in strands of material in the fabric and other control circuitry may be used to control the circuitry embedded in the fabric.


Find Patent Forward Citations

Loading…