The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Dec. 31, 2018
Applicant:

Hirata Corporation, Kumamoto, JP;

Inventors:

Hiroki Watanabe, Kumamoto, JP;

Tetsuya Sakai, Kumamoto, JP;

Hiroshi Kikai, Kumamoto, JP;

Assignee:

HIRATA CORPORATION, Kumamoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67271 (2013.01); H01L 21/67259 (2013.01); H01L 21/67294 (2013.01); H01L 21/681 (2013.01); H01L 21/68735 (2013.01); H01L 21/68764 (2013.01); H01L 21/68707 (2013.01);
Abstract

An alignment device which aligns notch portions of wafers includes mounting tables that hold the wafers, movement units that move the mounting tables, notch portion detection units that detect a circumferential positions of the notch portion, and a controller that controls positions of the mounting tables by the movement units. The mounting tables includes a mounting table main body portion and a pad member attached to an opening in the mounting table main body portion to hold the wafers. The pad member includes the main body portion that is attached to the opening and has a through hole in a center portion thereof, the first annular portion on an end side of the pad member to abut against wafers, and the first collar portion that is integrally provided with the first annular portion and the main body portion and extends toward outside of the main body portion.


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