The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Jul. 12, 2018
Applicant:

Visera Technologies Company Limited, Hsin-Chu, TW;

Inventors:

Chang-Wei Chen, Kaohsiung, TW;

Chih-Yu Chen, Yunlin County, TW;

Chen-Yi Wu, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/20 (2006.01); G02B 5/26 (2006.01); G02B 5/28 (2006.01); C23C 14/08 (2006.01); C23C 14/14 (2006.01); C23C 14/22 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
G02B 5/208 (2013.01); C23C 14/083 (2013.01); C23C 14/14 (2013.01); C23C 14/221 (2013.01); C23C 14/34 (2013.01); G02B 5/286 (2013.01);
Abstract

A method for fabricating an optical element is provided. The fabrication method includes the following steps. A substrate is provided. A plurality of first dielectric layers, a plurality of metal layers of Ag or its alloy and a plurality of second dielectric layers are formed over the substrate. The plurality of first dielectric layers and the plurality of metal layers are alternately formed over the substrate. The plurality of second dielectric layers are formed on one side away from the substrate of the plurality of metal layers and located between the plurality of metal layers and the plurality of first dielectric layers. An optical element fabricated by the method is also provided.


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