The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Oct. 29, 2014
Applicant:
Koninklijke Philips N.v., Eindhoven, NL;
Inventors:
Michael Scarsella, Eindhoven, NL;
Wojtek Sudol, Eindhoven, NL;
Assignee:
KONINKLIJKE PHILIPS N.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01S 7/52 (2006.01); A61B 8/00 (2006.01); B06B 1/06 (2006.01); G01S 15/89 (2006.01);
U.S. Cl.
CPC ...
G01S 7/5208 (2013.01); A61B 8/4444 (2013.01); A61B 8/4494 (2013.01); B06B 1/064 (2013.01); G01S 15/8925 (2013.01); A61B 8/4488 (2013.01); B06B 2201/55 (2013.01); B06B 2201/76 (2013.01); G01S 15/8915 (2013.01);
Abstract
An ultrasound probe is formed with protected interconnects, thereby resulting in a more robust probe. The interconnects are mounted between an array of transducer elements and an integrated circuit. The array of transducer elements are coupled to the interconnect via flip chip bumps or other structures. Underfill material fixedly positions the interconnects to the integrated circuit. A method of making the transducer assembly is provided.
Quick Actions:
Scarsella, Michael. (2022). Robust ultrasound transducer probes having protected integrated circuit interconnects (U.S. Patent No. 11231491). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11231491
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile