The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Aug. 07, 2018
Applicants:
Du Pont-toray Co., Ltd., Tokyo, JP;
Toyota Tsusho Matex Corporation, Osaka, JP;
Hirose Paper Mfg Co., Ltd., Tosa, JP;
Inventors:
Hideaki Machida, Tokyo, JP;
Shotaro Hidaka, Tokyo, JP;
Takaharu Kuno, Tokai, JP;
Naruaki Takahashi, Tokyo, JP;
Gen Ueta, Tosa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21H 13/26 (2006.01); D21H 17/56 (2006.01); D21H 23/24 (2006.01);
U.S. Cl.
CPC ...
D21H 13/26 (2013.01); D21H 17/56 (2013.01); D21H 23/24 (2013.01);
Abstract
A polyimide fiber paper-manufacturing method is provided that includes a short fiber-preparing step in which shaved short fibers of a non-thermoplastic polyimide are prepared, and a provisionally-bonded paper-forming step in which the short fibers are mixed with water-soluble polymers which are a material having a decomposition temperature lower than a glass transition point of polyimide, and subjected to wet-papermaking to form provisionally-bonded paper.