The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Jun. 01, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Donald Charles Abbott, Chartley, MA (US);
Kathryn Ann Schuck, Dallas, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 17/12 (2006.01); C25D 17/10 (2006.01); C25D 7/12 (2006.01); C25D 3/38 (2006.01); C25D 3/48 (2006.01); C25D 3/54 (2006.01);
U.S. Cl.
CPC ...
C25D 7/12 (2013.01); C25D 17/001 (2013.01); C25D 17/10 (2013.01); C25D 17/12 (2013.01); C25D 3/38 (2013.01); C25D 3/54 (2013.01);
Abstract
In described examples, a method for electroplating a semiconductor device includes: forming a metal foil; forming an inert anode support; attaching the metal foil to the inert anode support to form an anode; forming a cathode using a semiconductor substrate; immersing the anode and the cathode within an electrolyte solution; forming a circuit with a current source, the anode and the cathode; generating a current through the circuit; and electroplating a metal from the electrolyte solution onto the semiconductor substrate.