The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Dec. 08, 2020
Coretech System Co., Ltd., Zhubei, TW;
Rong-Yeu Chang, Zhubei, TW;
Yuing Chang, Zhubei, TW;
Chia-Hsiang Hsu, Zhubei, TW;
Ting-Yu Cheng, Zhubei, TW;
CORETECH SYSTEM CO., LTD., Zhubei, TW;
Abstract
The present disclosure provides a method of producing a molded product. The method comprises steps of performing, via computer-assisted engineering simulation software, a first simulation process to generate a plurality of molding conditions comprising a default injection velocity profile and a default packing pressure profile; conducting, via an injection-molding apparatus, a trial molding to inject a molding material into a mold using the default molding conditions and sensing a plurality of in-mold pressures at different sites in a mold cavity of the mold; and conducting, via an injection-molding apparatus, an actual molding to produce the molded product using the default molding conditions if a deviation of the in-mold pressures at an endpoint of a packing stage is less than a target value.