The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Jun. 06, 2016
Applicants:

Ncc Nano, Llc, Dallas, TX (US);

Rob Jacob Hendriks, Eindhoven, NL;

Kurt A. Schroder, Coupland, TX (US);

Inventors:

Rob Jacob Hendriks, Eindhoven, NL;

Kurt A. Schroder, Coupland, TX (US);

Assignee:

NCC NANO, LLC, Dallas, TX (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 41/42 (2006.01); B29C 41/02 (2006.01); B32B 7/00 (2019.01); B32B 7/06 (2019.01); B29L 7/00 (2006.01); B29L 31/34 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B29C 41/02 (2013.01); B29C 41/42 (2013.01); B32B 7/00 (2013.01); B32B 7/06 (2013.01); B29L 2007/008 (2013.01); B29L 2031/34 (2013.01); H01L 21/6836 (2013.01);
Abstract

A method and apparatus for delaminating a polymer film from a carrier plate is disclosed. The carrier plate is at least partially transparent and has deposited on it a pixelated pattern layer of light-absorptive material, upon which is deposited a layer of light-reflective material. A polymer film, which is to be delaminated, is deposited on the light-reflecting material layer. Next, a pulsed light source is utilized to irradiate through the carrier plate from the side opposite the polymer film to heat the light-absorptive material layer. The heated areas of the light-absorptive material layer, in turn, heat the polymer film through conduction at the interface between the light-absorptive material layer and the polymer film, thereby generating gas from the polymer film by its thermal decomposition, which allows the polymer film to be released from the carrier plate.


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