The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Oct. 02, 2018
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 3/007 (2013.01); H05K 3/0052 (2013.01); H05K 1/117 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0759 (2013.01); H05K 2203/1545 (2013.01);
Abstract
A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 μm or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.