The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Dec. 13, 2017
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Norio Chujo, Tokyo, JP;

Yutaka Uematsu, Tokyo, JP;

Masayoshi Yagyu, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0228 (2013.01); H05K 1/0245 (2013.01); H05K 1/113 (2013.01); H05K 1/0219 (2013.01); H05K 1/114 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10189 (2013.01);
Abstract

In a multilayer wiring board having through holes used in an electronic device, wiring is efficiently performed at high density while preventing crosstalk of differential signals. A wiring board includes: a plurality of pads arranged linearly at a predetermined pitch; a plurality of through holes arranged in parallel along an arrangement direction of the pads; and a wiring pattern connecting the pad to the through hole. Between the through holes connected to the pads which are connected to the ground via the wiring patterns, two through holes through which each of a pair of differential signals constituting a differential signal pair passes are provided such that a direction of a straight line connecting the two through holes is inclined to the arrangement direction of the pads.


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