The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

May. 10, 2019
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

Michael T. Barako, Redondo Beach, CA (US);

Jesse B. Tice, Torrance, CA (US);

Max H. Kuciej, Los Angeles, CA (US);

Assignee:

NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/02 (2006.01); H05B 3/34 (2006.01); B32B 5/02 (2006.01); B32B 5/12 (2006.01); B32B 5/26 (2006.01); C25D 5/34 (2006.01); H01L 23/373 (2006.01); H05B 3/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05B 3/34 (2013.01); B32B 5/028 (2013.01); B32B 5/12 (2013.01); B32B 5/26 (2013.01); C25D 5/34 (2013.01); H01L 23/3735 (2013.01); H05B 3/0004 (2013.01); H05K 7/2039 (2013.01); B32B 2262/103 (2013.01); H05B 2203/007 (2013.01); H05B 2203/014 (2013.01); H05B 2203/017 (2013.01); H05B 2214/04 (2013.01);
Abstract

A method for fabricating a multilayered metal nanowire array including providing a metal seed layer, stacking a plurality of porous templates on the seed layer so that a gap forms between each adjacent pair of templates, depositing by electroplating a metal in the pores so that the metal produces nanowires in the templates and lateral interposers in the gaps between the templates, and dissolving the templates so as to produce the multilayered nanowire array including the lateral interposers. The layers between the interposers can have the same or different thicknesses, the diameter and density of the pores in each layer can be the same or different and the metal deposited in the pores of the layers can be the same or different.


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