The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Sep. 11, 2019
Applicant:

Yushin Precision Equipment Co., Ltd., Kyoto, JP;

Inventors:

Mitsuharu Hamahata, Kyoto, JP;

Koji Ikeda, Kyoto, JP;

Ryuichi Kanazawa, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 29/08 (2006.01); B29C 45/76 (2006.01);
U.S. Cl.
CPC ...
H04L 67/125 (2013.01); B29C 45/76 (2013.01); B29C 2945/76006 (2013.01); B29C 2945/76494 (2013.01);
Abstract

There are provided a molded product manufacturing system that can be easily adapted to IoT and an apparatus for taking out a molded product that can promote adaptation of the molded product manufacturing system to IoT. A molded product manufacturing system includes an injection molding machine, an apparatus for taking out a molded product, and one or more peripheral devices arranged around the apparatus to operate together during operation of the apparatus. The apparatus includes a communication unit operable to transmit internal data to an external server via a communication network. The communication unit of the apparatus transmits external data, which is output from the one or more peripheral devices, to external servers together with information on a die.


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