The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Dec. 01, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Kenichi Uesaka, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/25 (2006.01); H01L 23/544 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1085 (2013.01); H01L 23/544 (2013.01); H03H 9/02559 (2013.01); H03H 9/059 (2013.01); H03H 9/25 (2013.01); H01L 2223/54406 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1815 (2013.01);
Abstract

An elastic wave device includes an elastic wave element mounted on a mounting substrate, with the elastic wave element being sealed by a sealing resin layer. The elastic wave element is bonded to electrode lands on the mounting substrate using bumps. Recessed portions are provided on a surface of the sealing resin layer on a side opposite to the side facing the mounting substrate. A ratio D/H between a depth of the recessed portions, and a distance of a portion of the sealing resin layer from the surface to a second main surface of a piezoelectric substrate, is no less than about 1/3.


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Uesaka, Kenichi. (2022). Elastic wave device (U.S. Patent No. 11228297). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11228297

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